US 11,658,141 B2
Die-to-wafer bonding structure and semiconductor package using the same
Jiseok Hong, Yongin-si (KR); Unbyoung Kang, Hwaseong-si (KR); Myungsung Kang, Yongin-si (KR); Taehun Kim, Asan-si (KR); Sangcheon Park, Hwaseong-si (KR); Hyuekjae Lee, Hwaseong-si (KR); and Jihwan Hwang, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Feb. 25, 2022, as Appl. No. 17/680,477.
Application 17/680,477 is a continuation of application No. 16/985,445, filed on Aug. 5, 2020, granted, now 11,289,438.
Claims priority of application No. 10-2019-0123973 (KR), filed on Oct. 7, 2019.
Prior Publication US 2022/0181285 A1, Jun. 9, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01); H01L 21/66 (2006.01); H01L 25/065 (2023.01); H01L 25/00 (2006.01)
CPC H01L 24/08 (2013.01) [H01L 22/22 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/92 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 23/481 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05564 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/06051 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29028 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/9211 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of forming a substrate bonding structure, the method comprising:
preparing a first substrate comprising a first metal pad, a first bonding pad on the first metal pad and penetrating a first insulating layer, and a first polymer layer surrounding all side surfaces of the first bonding pad;
preparing a second substrate comprising a second metal pad, a second bonding pad on the second metal pad and penetrating a second insulating layer, and a second polymer layer surrounding all side surfaces of the second bonding pad; and
bonding the first substrate and the second substrate such that the first bonding pad contacts the second bonding pad and the first polymer layer contacts the second polymer layer.