US 11,658,133 B2
Integrated circuit device
Stephane Jullian, Cheseaux-sur-Lausanne (CH); and Pascal Aubry, Cheseaux-sur-Lausanne (CH)
Assigned to Nagravision SA, Cheseaux-sur-Lausanne (CH)
Appl. No. 16/97,384
Filed by Nagravision SA, Cheseaux-sur-Lausanne (CH)
PCT Filed Apr. 27, 2017, PCT No. PCT/EP2017/060139
§ 371(c)(1), (2) Date Oct. 29, 2018,
PCT Pub. No. WO2017/186887, PCT Pub. Date Nov. 2, 2017.
Claims priority of application No. 1607589 (GB), filed on Apr. 29, 2016.
Prior Publication US 2019/0148313 A1, May 16, 2019
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 23/573 (2013.01) [H01L 23/576 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An integrated circuit device comprising:
a substrate having a first surface and a second surface opposite the first surface;
a protected circuit disposed on the first surface of the substrate;
a protective layer disposed within the substrate, between the first surface and the second surface, and configured to protect the protected circuit by absorbing laser radiation targeted at the protected circuit through the substrate, the protective layer being continuous over an entirety of the substrate; and
an insulating layer disposed within the substrate, between the first surface and the protective layer in a cross sectional view, and configured to electrically insulate the protected circuit from the protective layer and a portion of the substrate that is on a side of the protective layer that is opposite the insulating layer.