US 11,658,131 B2
Semiconductor package with dummy pattern not electrically connected to circuit pattern
Jin-Woo Park, Seoul (KR); Un-Byoung Kang, Hwaseong-si (KR); and Jong Ho Lee, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Feb. 5, 2021, as Appl. No. 17/168,337.
Claims priority of application No. 10-2020-0069123 (KR), filed on Jun. 8, 2020.
Prior Publication US 2021/0384143 A1, Dec. 9, 2021
Int. Cl. H01L 23/14 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/562 (2013.01) [H01L 23/14 (2013.01); H01L 23/49816 (2013.01); H01L 24/14 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a first substrate including a circuit pattern and a dummy pattern on an upper face of the first substrate,
the dummy pattern not being electrically connected to the circuit pattern, the first substrate including a solder resist layer on the circuit pattern and the dummy pattern, the solder resist layer including a first opening for exposing at least a part of the circuit pattern;
a solder ball in the first opening, the solder ball being electrically insulated from the dummy pattern by the solder resist layer;
a second substrate on the first substrate, the second substrate electrically connected to the first substrate by the solder ball, the second substrate being electrically insulated from the dummy pattern by the solder resist layer;
a stiffener on the first substrate; and
an underfill material layer between the first substrate and the second substrate, the underfill material layer wrapping around the solder ball, wherein
in a thickness direction, the dummy pattern is not between the stiffener and the first substrate,
the underfill material layer extends along the solder resist layer and overlaps a first part of the dummy pattern without overlapping a second part of the dummy pattern,
the first part of the dummy pattern and the second part of the dummy pattern are a contiguous part of the dummy pattern,
the second substrate includes a first side wall extending in a first direction, a second side wall extending in a second direction different from the first direction, and a corner at which the first side wall and the second side wall join, and
the dummy pattern overlaps the corner.