US 11,658,127 B2
RFI free picture frame metal stiffener
Eng Huat Goh, Ayer Itam (MY); Jiun Hann Sir, Gelugor (MY); Khang Choong Yong, Puchong (MY); Boon Ping Koh, Seberang Jaya (MY); Wil Choon Song, Bayan Lepas (MY); and Min Suet Lim, Gulugor (MY)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 27, 2019, as Appl. No. 16/454,423.
Prior Publication US 2020/0411448 A1, Dec. 31, 2020
Int. Cl. H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 23/49805 (2013.01); H01L 23/49816 (2013.01); H01L 24/09 (2013.01)] 28 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a package substrate on a substrate;
a die on the package substrate; and
a conductive stiffener over the package substrate and the substrate, wherein the conductive stiffener surrounds the package substrate, wherein the conductive stiffener has a top portion and a plurality of sidewalls, and wherein the top portion is directly disposed on and conductively coupled to the package substrate to provide power to the package substrate, and the plurality of sidewalls are vertically adjacent to the substrate.