US 11,658,124 B2
Connection structure embedded substrate
Yong Soon Jang, Suwon-si (KR); Hyung Ki Lee, Suwon-si (KR); and Ki Suk Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on May 6, 2021, as Appl. No. 17/313,310.
Claims priority of application No. 10-2020-0152195 (KR), filed on Nov. 13, 2020.
Prior Publication US 2022/0157730 A1, May 19, 2022
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/5385 (2013.01) [H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/5381 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 24/97 (2013.01); H01L 23/49894 (2013.01); H01L 24/16 (2013.01); H01L 2224/16235 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A connection structure embedded substrate, comprising:
a printed circuit board including a plurality of first insulating layers, and a plurality of first wiring layers disposed on or between the plurality of first insulating layers; and
a connection structure embedded in the printed circuit board, and including a plurality of second insulating layers and a plurality of second wiring layers disposed on or between the plurality of second insulating layers,
wherein a lowermost second insulating layer of the plurality of second insulating layers includes an organic insulating material, and is in contact with an upper surface of one of the plurality of first insulating layers, and
wherein the upper surface of the one of the plurality of first insulating layers has a stepped portion in a region in contact with the lowermost second insulating layer of the plurality of second insulating layers.