US 11,658,111 B2
Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge
Jiun Hann Sir, Gelugor (MY); Poh Boon Khoo, Perai (MY); Eng Huat Goh, Ayer Itam (MY); Amruthavalli Pallavi Alur, Tempe, AZ (US); and Debendra Mallik, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Mar. 12, 2021, as Appl. No. 17/200,700.
Application 17/200,700 is a continuation of application No. 16/384,348, filed on Apr. 15, 2019, granted, now 10,998,262.
Prior Publication US 2021/0202380 A1, Jul. 1, 2021
Int. Cl. H01L 23/522 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/5226 (2013.01) [H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 2224/02371 (2013.01); H01L 2224/02372 (2013.01); H01L 2924/01029 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated-circuit device package, comprising:
an interconnect bridge in a dielectric layer, the interconnect bridge comprising traces, and the interconnect bridge having a top side and a bottom side opposite the top side, a first side between the top side and the bottom side, and a second side between the top side and the bottom side;
a first plurality of vias in the dielectric layer, the first plurality of vias laterally adjacent to the first side of the interconnect bridge;
a second plurality of vias in the dielectric layer, the second plurality of vias laterally adjacent to the second side of the interconnect bridge;
a first integrated circuit chip attached to the top side of the interconnect bridge, the first integrated circuit chip electrically coupled to the first plurality of vias;
a second integrated circuit chip having a top side and a bottom side, the bottom side of the second integrated circuit chip attached to the top side of the interconnect bridge, the second integrated circuit chip electrically coupled to the second plurality of vias;
a plurality of chips coupled to the top side of the second integrated circuit chip; and
a plurality of bumps beneath the interconnect bridge, the plurality of bumps within a footprint defined by the first side and the second side of the interconnect bridge.