US 11,658,105 B2
Semiconductor package and manufacturing method thereof
Tuan-Yu Hung, Changhua County (TW); Ching-Feng Yang, Taipei (TW); Hung-Jui Kuo, Hsinchu (TW); Kai-Chiang Wu, Hsinchu (TW); and Ming-Che Ho, Tainan (TW)
Assigned to Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on May 24, 2021, as Appl. No. 17/327,785.
Application 17/327,785 is a division of application No. 16/513,727, filed on Jul. 17, 2019, granted, now 11,018,083.
Prior Publication US 2021/0305140 A1, Sep. 30, 2021
Int. Cl. H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 23/66 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 21/56 (2006.01); H01Q 1/22 (2006.01); H01Q 9/04 (2006.01); H01Q 9/28 (2006.01)
CPC H01L 23/49827 (2013.01) [H01L 21/56 (2013.01); H01L 21/76816 (2013.01); H01L 21/76871 (2013.01); H01L 23/3107 (2013.01); H01L 23/481 (2013.01); H01L 23/66 (2013.01); H01L 24/09 (2013.01); H01Q 1/2283 (2013.01); H01Q 9/0407 (2013.01); H01Q 9/285 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/02372 (2013.01)] 20 Claims
OG exemplary drawing
7. A manufacturing method of a semiconductor package, comprising:
forming an insulating layer over a carrier;
patterning the insulating layer to form a first insulating core and a second insulating core;
forming a first seed layer and a first conductive layer on a top surface and a sidewall of the first insulating core;
forming a second seed layer and a second conductive layer on a top surface and a sidewall of the second insulating core;
attaching a semiconductor die onto the carrier, wherein a through via structure comprising the first insulating core, the first seed layer and the first conductive layer as well as a dipole structure comprising the second insulating core, the second seed layer and the second conductive layer are located aside the semiconductor die;
laterally encapsulating the through via structure, the dipole structure and the semiconductor die with an encapsulant; and
removing the carrier.