US 11,658,104 B2
Intermediate substrate and fabrication method thereof
Shih-Ping Hsu, Hsinchu County (TW); Chu-Chin Hu, Hsinchu County (TW); and Pao-Hung Chou, Hsinchu County (TW)
Assigned to PHOENIX PIONEER TECHNOLOGY CO., LTD., Hsinchu County (TW)
Filed by PHOENIX PIONEER TECHNOLOGY CO., LTD., Hsinchu County (TW)
Filed on Feb. 24, 2022, as Appl. No. 17/679,245.
Claims priority of application No. 110107729 (TW), filed on Mar. 4, 2021.
Prior Publication US 2022/0285257 A1, Sep. 8, 2022
Int. Cl. H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01)
CPC H01L 23/49822 (2013.01) [H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49816 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H05K 1/0271 (2013.01); H05K 1/116 (2013.01); H05K 3/424 (2013.01); H05K 3/429 (2013.01); H05K 3/4682 (2013.01); H01L 21/563 (2013.01); H01L 24/16 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/3511 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An intermediate substrate, comprising:
a coreless circuit structure having opposite first and second surfaces, wherein both the first and second surfaces have circuit layers exposed therefrom;
a plurality of first conductive posts having opposite first and second end surfaces, wherein the first conductive posts are bonded and electrically connected to the circuit layer exposed from the first surface of the coreless circuit structure via the first end surfaces of the first conductive posts;
a first support member being a plate body having a plurality of mesh-shaped openings and having opposite first and second sides, wherein the first support member is disposed on the first surface of the coreless circuit structure via the first side of the first support member, and the plurality of first conductive posts are positioned in at least one of the mesh-shaped openings of the first support member;
a first insulating layer formed on the first surface of the coreless circuit structure for encapsulating the plurality of first conductive posts and the first support member, wherein the second end surfaces of the plurality of first conductive posts are exposed from the first insulating layer;
a plurality of second conductive posts having opposite first and second end surfaces, wherein the plurality of second conductive posts are bonded and electrically connected to the circuit layer exposed from the second surface of the coreless circuit structure via the first end surfaces of the second conductive posts;
a second support member being a plate body having a plurality of mesh-shaped openings and having opposite first and second sides, wherein the second support member is disposed on the second surface of the coreless circuit structure via the first side of the second support member, and the plurality of second conductive posts are positioned in at least one of the mesh-shaped openings of the second support member; and
a second insulating layer formed on the second surface of the coreless circuit structure for encapsulating the plurality of second conductive posts and the second support member, wherein the second end surfaces of the plurality of second conductive posts are exposed from the second insulating layer.