US 11,658,102 B2
Semiconductor device package and method of manufacturing the same
Yuanhao Yu, Kaohsiung (TW); Cheng Yuan Chen, Kaohsiung (TW); Chun Chen Chen, Kaohsiung (TW); Jiming Li, Kaohsiung (TW); and Chien-Wen Tu, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Jan. 22, 2020, as Appl. No. 16/749,635.
Prior Publication US 2021/0225747 A1, Jul. 22, 2021
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/66 (2006.01)
CPC H01L 23/49811 (2013.01) [H01L 21/4889 (2013.01); H01L 23/66 (2013.01); H01L 2223/6605 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A semiconductor device package, comprising:
a carrier;
an electronic component disposed on the carrier; and
a connector disposed on the carrier and electrically connected to the electronic component through the carrier, the connector having a first group of pins, a second group of pins and a group of common ground pins disposed between the first group of pins and the second group of pins to separate the first group of pins and the second group of pins,
wherein the connector and the electronic component are non-overlapping in a direction substantially perpendicular to a surface of the carrier, and
wherein a top surface of the connector is higher than a top surface of the electronic component.