US 11,658,083 B2
Film covers for sensor packages
Sreenivasan Kalyani Koduri, Allen, TX (US); Leslie Edward Stark, Heath, TX (US); Steven Alfred Kummerl, Carrollton, TX (US); and Wai Lee, Dallas, TX (US)
Assigned to Texas Instruments Incorporated, Dallas, TX (US)
Filed on Dec. 9, 2020, as Appl. No. 17/116,963.
Prior Publication US 2022/0181224 A1, Jun. 9, 2022
Int. Cl. H01L 23/31 (2006.01); H01L 25/065 (2023.01); H01L 23/14 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 21/56 (2006.01)
CPC H01L 23/31 (2013.01) [H01L 21/565 (2013.01); H01L 23/142 (2013.01); H01L 23/293 (2013.01); H01L 23/564 (2013.01); H01L 25/0655 (2013.01)] 20 Claims
OG exemplary drawing
1. A sensor package, comprising:
a semiconductor die having a sensor;
a mold compound covering a portion of the semiconductor die;
a cavity formed in a top surface of the mold compound, the sensor in the cavity;
an adhesive abutting the top surface of the mold compound; and
a semi-permeable film abutting the adhesive and covering the cavity, the semi-permeable film approximately flush with at least four edges of the top surface of the mold compound, wherein the semi-permeable film is permeable to at least one fluid.