US 11,658,083 B2
Film covers for sensor packages
Sreenivasan Kalyani Koduri, Allen, TX (US); Leslie Edward Stark, Heath, TX (US); Steven Alfred Kummerl, Carrollton, TX (US); and Wai Lee, Dallas, TX (US)
Assigned to Texas Instruments Incorporated, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Dec. 9, 2020, as Appl. No. 17/116,963.
Prior Publication US 2022/0181224 A1, Jun. 9, 2022
Int. Cl. H01L 23/31 (2006.01); H01L 25/065 (2023.01); H01L 23/14 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 21/56 (2006.01)
CPC H01L 23/31 (2013.01) [H01L 21/565 (2013.01); H01L 23/142 (2013.01); H01L 23/293 (2013.01); H01L 23/564 (2013.01); H01L 25/0655 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A sensor package, comprising:
a semiconductor die having a sensor;
a mold compound covering a portion of the semiconductor die;
a cavity formed in a top surface of the mold compound, the sensor in the cavity;
an adhesive abutting the top surface of the mold compound; and
a semi-permeable film abutting the adhesive and covering the cavity, the semi-permeable film approximately flush with at least four edges of the top surface of the mold compound, wherein the semi-permeable film is permeable to at least one fluid.