US 11,658,059 B2
Thin material handling carrier
John W. Stayt, Jr., Schnecksville, PA (US); Thomas Barrie, Annandale, NJ (US); Raven Persaud, Old Bridge, NJ (US); Garrett Korpinen, Bethlehem, PA (US); and Geoffrey Robert Hale, Darlington (GB)
Assigned to II-VI Delaware, Inc., Wilmington, DE (US)
Filed by II-VI Delaware, Inc., Wilmington, DE (US)
Filed on Feb. 26, 2019, as Appl. No. 16/285,387.
Claims priority of provisional application 62/636,320, filed on Feb. 28, 2018.
Prior Publication US 2019/0267276 A1, Aug. 29, 2019
Int. Cl. H01L 21/687 (2006.01); H01L 21/683 (2006.01); H01L 23/544 (2006.01); H01L 21/673 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/68735 (2013.01) [H01L 21/67294 (2013.01); H01L 21/67346 (2013.01); H01L 21/6838 (2013.01); H01L 21/68721 (2013.01); H01L 21/68728 (2013.01); H01L 23/544 (2013.01); H01L 2223/54426 (2013.01)] 17 Claims
OG exemplary drawing
1. A wafer carrier comprising
a bottom support plate upon which a wafer may be positioned, the bottom support plate including a plurality of apertures formed therethrough, the apertures for pulling a vacuum force and maintaining the wafer in place during subsequent operations;
a holding ring disposed to surround the periphery of the wafer and engage with the bottom support plate to hold the wafer in a fixed position between the bottom support plate and the holding ring; and
a clamp ring disposed over the holding ring, the clamp ring configured to engage with the bottom support plate and secure an included wafer disposed therebetween, wherein the clamp ring further comprises a plurality of pins disposed around the inner periphery thereof and formed to contact outer areas of the included wafer and provide additional secure positioning of the included wafer within the wafer carrier.