US 11,658,058 B2
Substrate holding apparatus
Takahiro Abe, Tokyo (JP); Takuya Tsushima, Tokyo (JP); and Tomonori Hirao, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Filed by EBARA CORPORATION, Tokyo (JP)
Filed on Feb. 9, 2021, as Appl. No. 17/171,384.
Claims priority of application No. JP2020-027355 (JP), filed on Feb. 20, 2020.
Prior Publication US 2021/0262109 A1, Aug. 26, 2021
Int. Cl. B32B 43/00 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); H01L 21/677 (2006.01)
CPC H01L 21/6838 (2013.01) [H01L 21/67742 (2013.01); H01L 21/68707 (2013.01); B32B 43/006 (2013.01); Y10T 156/1168 (2015.01); Y10T 156/1179 (2015.01); Y10T 156/1994 (2015.01)] 8 Claims
OG exemplary drawing
 
1. A substrate holding apparatus to hold a substrate including a portion to be plated that is exposed to a plating solution and an edge portion that is an area outside the portion to be plated, the substrate holding apparatus comprising:
a gripper configured to come in contact with the edge portion of the substrate and thereby grasp the substrate:
a suction mechanism configured to attract the portion to be plated of the substrate by suction to hold the portion to be plated; and
a protrusion provided at a position corresponding to the portion to be plated of the substrate, and protruding toward the substrate held by the substrate holding apparatus more than the suction mechanism protrudes toward the substrate.