US 11,658,057 B2
Wafer chuck
Sungil Choi, Hwaseong-si (KR); Hyeondong Song, Suwon-si (KR); Myeongshik Shim, Hwaseong-si (KR); Jonghyun Hong, Hwaseong-si (KR); and Bonggyo Seo, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Sep. 23, 2020, as Appl. No. 17/29,402.
Claims priority of application No. 10-2020-0011351 (KR), filed on Jan. 30, 2020.
Prior Publication US 2021/0242069 A1, Aug. 5, 2021
Int. Cl. H01L 21/683 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/6838 (2013.01) [H01L 21/68735 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A wafer chuck comprising:
a body portion;
a vacuum barrier portion including a wall structure arranged at a same distance from a center point of the body portion;
protrusions inside and outside the vacuum barrier portion, protruding from a top surface of the body portion and spaced apart from each other; and
a vacuum portion including vacuum holes spaced apart from each other penetrating the body portion inside the vacuum barrier portion, the vacuum holes including a first set of vacuum holes, the first set of vacuum holes including subvacuum holes arranged around a central protrusion of the protrusions and between the central protrusion and protrusions adjacent to the central protrusion.