US 11,658,049 B2
Electromigration evaluation methodology with consideration of thermal and signal effects
Hsien Yu Tseng, Hsinchu (TW); and Sheng-Feng Liu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Aug. 20, 2021, as Appl. No. 17/407,876.
Application 17/407,876 is a division of application No. 16/563,799, filed on Sep. 6, 2019, granted, now 11,107,714.
Claims priority of provisional application 62/753,533, filed on Oct. 31, 2018.
Prior Publication US 2021/0384054 A1, Dec. 9, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 30/39 (2020.01); H01L 21/67 (2006.01); G06F 30/367 (2020.01); G06F 30/398 (2020.01); G06F 119/08 (2020.01)
CPC H01L 21/67248 (2013.01) [G06F 30/367 (2020.01); G06F 30/398 (2020.01); G06F 2119/08 (2020.01)] 20 Claims
OG exemplary drawing
 
1. A system for evaluating a heat sensitive structure of an integrated circuit design comprising:
a memory configured for maintaining integrated circuit design layout data, thermal data, process data, and operational parameters corresponding to the integrated circuit design;
a processor configured for accessing the memory and analyzing the integrated circuit design layout data to identify
a heat sensitive structure having a nominal temperature Tnom;
a first heat generating structure within a first thermal coupling range of the heat sensitive structure; and
a first heat dissipating structure within a second thermal coupling range of the heat sensitive structure;
the processor being further configured for
calculating a ΔTh1 for the heat sensitive structure induced by thermal coupling with the first heat generating structure;
calculating a ΔTc1 for the heat sensitive structure induced by thermal coupling with the first heat dissipating structure; and
conducting an electromigration (EM) evaluation of the heat sensitive structure at an adjusted evaluation temperature TE=Tnom+ΔTh1+ΔTc1; and
a network interface configured for transmitting a result of the EM evaluation for a design review.