US 11,658,012 B2
Control method and plasma processing apparatus
Toshiyuki Arakane, Miyagi (JP); Tetsu Tsunamoto, Miyagi (JP); Masanori Sato, Miyagi (JP); and Yoshinori Osaki, Miyagi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Dec. 11, 2020, as Appl. No. 17/118,987.
Claims priority of application No. JP2019-224851 (JP), filed on Dec. 12, 2019.
Prior Publication US 2021/0183625 A1, Jun. 17, 2021
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32449 (2013.01) [H01J 37/32082 (2013.01); H01J 37/32577 (2013.01); H01J 2237/24571 (2013.01); H01J 2237/334 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A control method comprising:
(a) connecting a power supply to an electrode of an electrostatic chuck inside a chamber and applying a voltage from the power supply to the electrode;
(b) after (a), switching a connection between the electrode and the power supply to a non-connection state;
(c) after (b), supplying a gas into the chamber to generate plasma;
(d) obtaining a potential drop value by measuring a potential of the electrode during (c);
determining an HV voltage based on the potential drop value; and
applying the HV voltage to the electrode to eliminate electric charges accumulated on a surface layer of the electrostatic chuck.