US 11,657,989 B2
Method for making a three-dimensional liquid crystal polymer multilayer circuit board including membrane switch including air
Louis Joseph Rendek, Jr., Melbourne, FL (US); Lawrence Wayne Shacklette, Melbourne, FL (US); Paul Brian Jaynes, Melbourne, FL (US); and Philip Anthony Marvin, Melbourne, FL (US)
Assigned to HARRIS CORPORATION, Melbourne, FL (US)
Filed by HARRIS CORPORATION, Melbourne, FL (US)
Filed on Sep. 23, 2020, as Appl. No. 17/29,282.
Application 17/029,282 is a division of application No. 15/890,532, filed on Feb. 7, 2018, granted, now 10,818,448.
Application 15/890,532 is a division of application No. 14/810,507, filed on Jul. 28, 2015, granted, now 9,922,783, issued on Mar. 20, 2018.
Application 14/810,507 is a division of application No. 12/016,089, filed on Jan. 17, 2008, granted, now 9,117,602, issued on Aug. 25, 2015.
Prior Publication US 2021/0005405 A1, Jan. 7, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01H 13/704 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01); H01H 11/00 (2006.01); H05K 1/02 (2006.01)
CPC H01H 13/704 (2013.01) [H01H 11/00 (2013.01); H05K 3/303 (2013.01); H05K 3/4614 (2013.01); H05K 3/4626 (2013.01); H05K 3/4632 (2013.01); H05K 1/0284 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/091 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49107 (2015.01)] 7 Claims
OG exemplary drawing
1. A method for making an electronic device comprising:
forming a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein filled with air, the multilayer circuit board comprising at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess filled with air to define a membrane switch;
wherein forming the multilayer circuit board comprises
forming a stacked arrangement comprising at least one pair of LCP layers with a bonding layer therebetween, and
heating the stacked arrangement to shape the stacked arrangement into the non-planar three-dimensional shape and concurrently causing the bonding layer to bond together the adjacent LCP layers of the stacked arrangement.