US 11,657,930 B2
High temperature superconducting wires having increased engineering current densities
Martin W. Rupich, Framingham, MA (US)
Assigned to American Superconductor Corporation, Ayer, MA (US)
Filed by American Superconductor Corporation, Ayer, MA (US)
Filed on Jul. 9, 2020, as Appl. No. 16/925,268.
Application 16/925,268 is a division of application No. 15/593,835, filed on May 12, 2017, granted, now 10,804,010.
Prior Publication US 2020/0350101 A1, Nov. 5, 2020
Prior Publication US 2020/0350101 A1, Nov. 5, 2020
Int. Cl. H01B 12/14 (2006.01)
CPC H01B 12/14 (2013.01) [H10N 60/0324 (2023.02); H10N 60/0521 (2023.02); H10N 60/0801 (2023.02); H10N 60/203 (2023.02); H10N 60/857 (2023.02)] 10 Claims
OG exemplary drawing
 
1. A method of making a laminated superconductor wire, the method comprising the following steps:
a) providing a superconductor insert having a first high temperature superconductor layer with a first surface and a second surface opposite the first surface, the first surface overlaying and in direct contact with a surface of a biaxially textured substrate, and a first electrically conductive cap layer overlaying and in direct physical contact with a second surface of the first high temperature superconductor layer;
b) affixing the first electrically conductive cap layer of the superconductor insert to a first surface of a stabilizer layer;
c) removing the biaxially textured substrate from the first the high temperature superconductor layer to expose the first surface of the first high temperature superconductor layer;
d) collecting on a reel the removed biaxially textured substrate;
e) affixing a second electrically conductive cap layer to the first surface of the first high temperature superconductor layer;
f) affixing a first lamination layer to the second electrically conductive cap layer; and affixing a second lamination layer to a second surface of the stabilizer layer; wherein the step of affixing the first and second lamination layers includes disposing a first fillet along a first edge of the laminated superconductor wire assembly and connected to the first lamination layer and the second lamination layer and disposing a second fillet along a second edge of the laminated superconductor wire assembly and connected to the first lamination layer and the second lamination layer; and
g) reusing the reel of biaxially textured substrate removed from the first high temperature superconductor layer in step d) to deposit, using a reel to reel process, a second high temperature superconductor layer with a surface overlaying and in direct contact with the surface of the removed biaxially textured substrate.