US 11,657,014 B2
Signal bridging using an unpopulated processor interconnect
Jason R. Talbert, Austin, TX (US)
Assigned to ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed by ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed on Dec. 8, 2020, as Appl. No. 17/115,384.
Prior Publication US 2022/0179817 A1, Jun. 9, 2022
Int. Cl. G06F 13/40 (2006.01); G06F 13/20 (2006.01); G06F 9/4401 (2018.01)
CPC G06F 13/4027 (2013.01) [G06F 13/20 (2013.01); G06F 9/4405 (2013.01); G06F 2213/40 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of signal bridging using a processor interconnect, the method comprising:
communicatively coupling an apparatus to a first signal path between a bootstrap processor (BSP) and a processor interconnect of a circuit board;
communicatively coupling the apparatus to a second signal path between the processor interconnect and a peripheral interface of the circuit board;
communicatively coupling the BSP to the peripheral interface via a third signal path in the apparatus; and
communicatively coupling one or more other peripheral interfaces in the apparatus to the BSP via a fourth signal path in the apparatus.