US 11,656,980 B2
Extensible memory dual inline memory module
Yu-Wei Hsieh, Beijing (CN); Po Chia Chen, Beijing (CN); Li-Ping Zhang, Beijing (CN); and Tai Wei Hsia, Beijing (CN)
Assigned to Lenovo Enterprise Solutions (Singapore) Pte. Ltd., New Tech Park (SG)
Filed by Lenovo Enterprise Solutions (Singapore) Pte. Ltd., New Tech Park (SG)
Filed on Oct. 9, 2020, as Appl. No. 17/67,578.
Prior Publication US 2021/0109849 A1, Apr. 15, 2021
Int. Cl. G06F 12/02 (2006.01); G06F 3/06 (2006.01); G11C 5/04 (2006.01)
CPC G06F 12/023 (2013.01) [G06F 3/0685 (2013.01); G11C 5/04 (2013.01); G06F 2212/205 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An extensible memory subsystem, comprising:
a dual in-line memory module (DIMM), comprising:
a dynamic random-access memory (DRAM) having a basic memory space;
3a DIMM memory controller coupled to the DRAM;
a memory interface configured to couple the DIMM to a DIMM connector of a computing device; and
a first extension interface configured to couple the DIMM to a first remote memory module having a first remote memory space, wherein the DIMM memory controller is configured to map a DIMM memory space comprising the basic memory space of the DRAM and the first remote memory space of the first remote memory module, the DIMM memory space accessible by the computing device upon the DIMM being coupled to the computing device via the memory interface, wherein the first extension interface comprises a networking interface circuit configured to couple the DIMM memory controller to the first remote memory module; and
a first remote memory module coupled to the DIMM via the first extension interface of the DIMM.