US 11,656,718 B2
Method and apparatus for variable impedance touch sensor array force aware interaction in large surface devices
John Aaron Zarraga, San Francisco, CA (US); Alexander Meagher Grau, Durham, NC (US); Bethany Noel Haniger, Los Gatos, CA (US); Bradley James Bozarth, Moore, SC (US); Brogan Carl Miller, Mountain View, CA (US); Ilya Daniel Rosenberg, Mountain View, CA (US); James Frank Thomas, Danville, CA (US); Mark Joshua Rosenberg, Sunnyvale, CA (US); Peter Hans Nyboer, San Jose, CA (US); Reuben Eric Martinez, Gilroy, CA (US); Scott Gregory Isaacson, Mountain View, CA (US); Stephanie Jeanne Oberg, Sunnyvale, CA (US); Timothy James Miller, Half Moon Bay, CA (US); Tomer Moscovich, San Francisco, CA (US); and Yibo Yu, Santa Clara, CA (US)
Assigned to SENSEL, INC., Sunnyvale, CA (US)
Filed by Sensel, Inc., Sunnyvale, CA (US)
Filed on Apr. 22, 2021, as Appl. No. 17/237,224.
Application 17/237,224 is a continuation of application No. 16/519,319, filed on Jul. 23, 2019, granted, now 10,990,223.
Claims priority of provisional application 62/730,752, filed on Sep. 13, 2018.
Prior Publication US 2021/0240296 A1, Aug. 5, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 3/041 (2006.01); G06F 3/044 (2006.01); G01L 1/14 (2006.01); G01L 1/20 (2006.01)
CPC G06F 3/0418 (2013.01) [G01L 1/146 (2013.01); G01L 1/205 (2013.01); G06F 3/044 (2013.01); G06F 3/0414 (2013.01); G06F 2203/04104 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A system for detecting a continuous pressure curve for a touch on a display device, comprising:
a column switching register;
a plurality of physical variable impedance array (VIA) columns connected by interlinked impedance columns;
a plurality of physical VIA rows connected by interlinked impedance rows;
an array of column drivers configured to:
based on the column switching register, select the interlinked impedance columns, and
connect, via the selected the interlinked impedance columns, to the selected interlinked impedance columns and to the plurality of physical VIA columns;
a plurality of row sense sinks connected to the interlinked impedance rows and to the plurality of physical VIA rows through the interlinked impedance rows; and
a processor configured to interpolate the continuous pressure curve in the physical VIA columns and physical VIA rows from an electrical signal from the array of column drivers, sensed at the plurality of row sense sinks.