US 11,656,696 B2
Touch pad structure
Yu-Shih Wang, New Taipei (TW); Wen-Chieh Tai, New Taipei (TW); Cheng-Nan Ling, New Taipei (TW); and Chih-Chun Liu, New Taipei (TW)
Assigned to Acer Incorporated, New Taipei (TW)
Filed by Acer Incorporated, New Taipei (TW)
Filed on Mar. 21, 2022, as Appl. No. 17/699,179.
Application 17/699,179 is a continuation of application No. 17/148,598, filed on Jan. 14, 2021, granted, now 11,314,343.
Claims priority of application No. 109113791 (TW), filed on Apr. 24, 2020.
Prior Publication US 2022/0206600 A1, Jun. 30, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 3/041 (2006.01); G06F 3/0354 (2013.01)
CPC G06F 3/03547 (2013.01) 10 Claims
OG exemplary drawing
1. A touch pad structure, comprising:
a touch module;
a first bracket, the touch module being disposed on the first bracket;
a second bracket, surrounding the first bracket and the touch module, a plurality of outer edges of the first bracket facing to a plurality of inner edges of the second bracket respectively; and
a plurality of linkage rods, each of the linkage rods being pivotally connected the outer edge and the inner edge facing to each other, so that the touch module is moved together with the first bracket and relative to the second bracket when the touch module is pressed or released, and the linkage rods have synchronized seesaw motion.