US 11,656,676 B2
System, apparatus and method for dynamic thermal distribution of a system on chip
Rolf Kuehnis, Portland, OR (US); Matthew Long, Portland, OR (US); and Julien Sebot, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 12, 2018, as Appl. No. 16/217,312.
Prior Publication US 2020/0192462 A1, Jun. 18, 2020
Int. Cl. G06F 1/32 (2019.01); G06F 1/3296 (2019.01); G01K 7/02 (2021.01); H03K 17/082 (2006.01)
CPC G06F 1/3296 (2013.01) [G01K 7/021 (2013.01); H03K 17/082 (2013.01)] 12 Claims
OG exemplary drawing
 
11. A system comprising:
a processor having a plurality of cores and a plurality of low dropout regulators to power the plurality of cores, wherein a first low dropout regulator of the plurality of low dropout regulators comprises a plurality of power gates, wherein when a hot spot region is identified within a first core associated with the first low dropout regulator, at least some of the plurality of power gates of the first low dropout regulator are to be disabled;
a non-volatile fuse storage to store configuration information regarding the plurality of low dropout regulators, the non-volatile fuse storage to store a plurality of indicators, each to indicate whether a corresponding one of the plurality of low dropout regulators is to be enabled, wherein the plurality of low dropout regulators are oversubscribed with respect to the plurality of cores and at least one of the plurality of low dropout regulators is to be statically fused to be disabled at manufacture; and
a system memory coupled to the processor.