US 11,656,665 B2
Hybrid cooling systems for datacenters
Ali Heydari, Albany, CA (US)
Assigned to NVIDIA Corporation, Santa Clara, CA (US)
Filed by Nvidia Corporation, Santa Clara, CA (US)
Filed on Jun. 24, 2021, as Appl. No. 17/357,589.
Prior Publication US 2022/0413572 A1, Dec. 29, 2022
Int. Cl. G06F 1/20 (2006.01); G05B 15/02 (2006.01); H05K 7/20 (2006.01)
CPC G06F 1/206 (2013.01) [G05B 15/02 (2013.01); H05K 7/20836 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A hybrid cooling unit, comprising:
an evaporative cooler to provide a source of cooled air and a liquid heat exchanger to provide a source of cooled liquid for cooling one or more electronic components, the hybrid cooling unit further including an air inlet to direct a flow of external air to remove heat from the evaporative cooler and the liquid heat exchanger.