US 11,656,355 B2
Direct chip-on-array for a multidimensional transducer array
Baik Woo Lee, Issaquah, WA (US)
Assigned to Siemens Medical Solutions USA, Inc., Malvern, PA (US)
Filed by Siemens Medical Solutions USA, Inc., Malvern, PA (US)
Filed on Jul. 15, 2020, as Appl. No. 16/947,018.
Prior Publication US 2022/0018957 A1, Jan. 20, 2022
Int. Cl. B06B 1/06 (2006.01); G01S 15/89 (2006.01); A61B 8/08 (2006.01)
CPC G01S 15/8993 (2013.01) [A61B 8/483 (2013.01); B06B 1/06 (2013.01)] 20 Claims
OG exemplary drawing
1. A multidimensional transducer array system, the system comprising:
an acoustic array having transducer elements distributed in a grid over first and second dimensions, the acoustic array having a first extent of the transducer elements along the first dimension;
a dematching layer connected with the acoustic array in an acoustic stack, the dematching layer supporting the transducer elements on a first side and extending by a second extend along the first dimension, the second extent greater than the first extent;
a chip of an application specific integrated circuit directly bonded to a second side of the dematching layer, the second side opposite the first side; and
a flexible circuit connected to the dematching layer on the first side.