US 11,656,275 B2
Injection device, semiconductor testing system and its testing method
Bo-Lung Chen, Hsinchu (TW); and Wen-Yuan Hsu, Hsinchu (TW)
Assigned to HERMES TESTING SOLUTIONS INC., Hsinchu (TW)
Filed by HERMES TESTING SOLUTIONS INC., Hsinchu (TW)
Filed on Jul. 13, 2022, as Appl. No. 17/863,681.
Application 17/863,681 is a division of application No. 16/597,117, filed on Oct. 9, 2019.
Claims priority of application No. 108123824 (TW), filed on Jul. 5, 2019.
Prior Publication US 2022/0349939 A1, Nov. 3, 2022
Int. Cl. G01R 31/317 (2006.01); G01N 33/487 (2006.01); H01L 21/67 (2006.01); H01L 21/66 (2006.01)
CPC G01R 31/31702 (2013.01) [G01N 33/48707 (2013.01); H01L 21/67 (2013.01); H01L 21/6715 (2013.01); H01L 21/67017 (2013.01); H01L 22/20 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A semiconductor testing method comprising steps:
placing a semiconductor element on a supporter, wherein the semiconductor element has a plurality of electrode pads and a test area;
providing a testing member including a plurality of electric-conduction elements and at least one opening, wherein the position of the opening is corresponding to the test area, and wherein the plurality of electric-conduction elements contacts the plurality of electrode pads of the semiconductor element;
providing an injection device including a reservoir, wherein the reservoir has at least one connecting port and a dropping port;
actuating the dropping port of the injection device to pass through the opening of the testing member and contact the test area of the semiconductor element;
injecting a first testing liquid through the at least one connecting port of the injection device into the reservoir, and letting the first testing liquid contact the test area of the semiconductor element through the dropping port for testing electric signals of the semiconductor element;
injecting a cleaning liquid through the at least one connecting port of the injection device into the reservoir for cleaning the reservoir and the test area of the semiconductor element;
actuating the dropping port of the injection device to depart from the test area of the semiconductor element;
before the dropping port of the injection device is contacting the test area of the semiconductor element, driving a blocking element of the injection device to press against the dropping port of the injection device; and
injecting the cleaning liquid through the at least one connecting port of the injection device into the reservoir for cleaning the reservoir.