US 11,656,274 B2
Systems and methods for evaluating the reliability of semiconductor die packages
Robert J. Rathert, Mechanicsville, VA (US); David W. Price, Austin, TX (US); Chet V. Lenox, Lexington, TX (US); and Oreste Donzella, San Ramon, CA (US)
Assigned to KLA Corporation, Milpitas, CA (US)
Filed by KLA Corporation, Milpitas, CA (US)
Filed on Mar. 25, 2021, as Appl. No. 17/212,877.
Claims priority of provisional application 63/149,367, filed on Feb. 15, 2021.
Prior Publication US 2022/0260632 A1, Aug. 18, 2022
Int. Cl. G01R 31/28 (2006.01); H01L 21/66 (2006.01)
CPC G01R 31/2894 (2013.01) [G01R 31/2856 (2013.01); H01L 22/34 (2013.01)] 35 Claims
OG exemplary drawing
 
1. A system comprising:
a controller, wherein the controller includes one or more processors and memory, wherein the memory is configured to store a set of program instructions, wherein the one or more processors are configured to execute program instructions causing the one or more processors to:
receive semiconductor die data about a plurality of semiconductor dies from a plurality of semiconductor die supplier subsystems, wherein the semiconductor die data includes an inline part average testing (I-PAT) score for each of the plurality of semiconductor dies, wherein the I-PAT score represents a weighted defectivity of the corresponding semiconductor die;
filter a high-risk subset of the plurality of semiconductor dies with a Known Good Die (KGD) subsystem, wherein the high-risk subset of the plurality of semiconductor dies includes one or more semiconductor die rejects with corresponding I-PAT scores equal to or above a high-risk I-PAT score threshold of the plurality of I-PAT score thresholds;
sort the plurality of semiconductor dies with the KGD subsystem based on a comparison of the I-PAT score of each of the plurality of semiconductor dies to the plurality of I-PAT score thresholds; and
transmit semiconductor die reliability data about the sorted plurality of semiconductor dies to a plurality of semiconductor die packager subsystems.