US 11,656,273 B1
High current device testing apparatus and systems
Gregory Cruzan, San Jose, CA (US); Karthik Ranganathan, San Jose, CA (US); Mohammad Ghazvini, San Jose, CA (US); Paul Ferrari, San Jose, CA (US); Samer Kabbani, San Jose, CA (US); and Todd Berk, San Jose, CA (US)
Assigned to Advantest Test Solutions, Inc., San Jose, CA (US)
Filed by Advantest Test Solutions, Inc., San Jose, CA (US)
Filed on Nov. 5, 2021, as Appl. No. 17/520,202.
Int. Cl. G01R 31/28 (2006.01)
CPC G01R 31/2877 (2013.01) [G01R 31/2879 (2013.01)] 26 Claims
OG exemplary drawing
 
1. An active thermal interposer (ATI) device for use in testing a device under test (DUT), said ATI device comprising:
a body layer having a first surface and a second surface, wherein said first surface is operable to be disposed adjacent to a cold plate of a thermal head and wherein said second surface is operable to be disposed adjacent to said DUT during testing thereof;
a plurality of heater elements disposed within said body layer;
a plurality of recessed pads disposed within recesses of said first surface of said body layer and wherein said plurality of recessed pads are electrically coupled to said plurality of heater elements; and
a plurality of copper discs disposed on top of, and in electrical contact with, said plurality of recessed pads within said recesses and aligned wherein said plurality of cooper discs remain recessed with respect to said first surface and wherein said plurality of copper discs is operable to contact a corresponding plurality of pins of said thermal head to receive driving electrical signals therefrom.