US 11,656,271 B2
Wafer inspection system
Yi-Hsuan Cheng, Chu-Pei (TW); Hung-I Lin, Chu-Pei (TW); and Po-Han Peng, Chu-Pei (TW)
Assigned to MPI CORPORATION, Chu-Pei (TW)
Filed by MPI CORPORATION, Chu-Pei (TW)
Filed on Mar. 21, 2022, as Appl. No. 17/699,610.
Claims priority of provisional application 63/212,129, filed on Jun. 18, 2021.
Claims priority of provisional application 63/164,027, filed on Mar. 22, 2021.
Claims priority of application No. 111102442 (TW), filed on Jan. 20, 2022.
Prior Publication US 2022/0299564 A1, Sep. 22, 2022
Int. Cl. G01R 1/067 (2006.01); G01R 31/28 (2006.01)
CPC G01R 31/2865 (2013.01) [G01R 1/06727 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A wafer inspection system, which is defined with a vertical axis and a horizontal axis perpendicular to the vertical axis, the wafer inspection system comprising:
a supporting device comprising a supporting portion and a contact portion located around an outer periphery of the supporting portion, the supporting portion and the contact portion being electrically conductive and electrically connected with each other, the supporting portion being configured to support a back of a wafer in a way that the wafer is electrically connected with the contact portion; and
a probe device disposed above the supporting portion and the contact portion in a way that the probe device and the supporting device are movable relative to each other along the vertical axis and the horizontal axis, the probe device is capable of being electrically connected with a driver IC and transmitting a test signal of the driver IC, the probe device comprising a probe region and a contact region located around an outer periphery of the probe region, the probe region comprising an electrically conductive probe protruding downwardly toward the supporting device for contacting a front of the wafer, the contact region comprising an electrically conductive module, the electrically conductive module comprising a plurality of elastic contact members protruding toward the supporting device, when the front of the wafer is contacted by the probe, the electrically conductive module and the contact portion of the supporting device being abutted against each other, thereby forming a test loop;
wherein the probe of the probe device has a probe tip for contacting the wafer; each of the elastic contact members has a contact tip for being abutted against the contact portion of the supporting device; the contact portion of the supporting device has a contact surface for the contact tip of the elastic contact member to be abutted thereagainst; the contact tip of each of the elastic contact members is located higher than the probe tip of the probe along the vertical axis; the contact surface of the supporting device is located higher than the front of the wafer along the vertical axis.