US 11,656,195 B2
Automatic analyte sensor calibration and error detection
Naresh C. Bhavaraju, San Diego, CA (US); Becky L. Clark, San Diego, CA (US); Vincent P. Crabtree, San Diego, CA (US); Chris W. Dring, San Diego, CA (US); Arturo Garcia, Chula Vista, CA (US); Jason Halac, San Diego, CA (US); Jonathan Hughes, Encinitas, CA (US); Jeff Jackson, Poway, CA (US); Lauren Hruby Jepson, San Diego, CA (US); David I-Chun Lee, San Diego, CA (US); Ted Tang Lee, San Diego, CA (US); Rui Ma, San Diego, CA (US); Zebediah L. McDaniel, San Diego, CA (US); Jason Mitchell, Poway, CA (US); Andrew Attila Pal, San Diego, CA (US); Daiting Rong, San Diego, CA (US); Disha B. Sheth, Oceanside, CA (US); Peter C. Simpson, Cardiff, CA (US); Stephen J. Vanslyke, Carlsbad, CA (US); Matthew D. Wightlin, San Diego, CA (US); Anna Leigh Davis, Cardiff by the Sea, CA (US); Hari Hampapuram, San Diego, CA (US); Aditya Sagar Mandapaka, San Diego, CA (US); Alexander Leroy Teeter, Poway, CA (US); and Liang Wang, La Jolla, CA (US)
Assigned to Dexcom, Inc., San Diego, CA (US)
Filed by DexCom, Inc., San Diego, CA (US)
Filed on May 2, 2019, as Appl. No. 16/402,101.
Application 16/402,101 is a continuation of application No. 16/402,013, filed on May 2, 2019.
Claims priority of provisional application 62/666,606, filed on May 3, 2018.
Prior Publication US 2019/0339222 A1, Nov. 7, 2019
Int. Cl. G01N 27/327 (2006.01); A61B 5/145 (2006.01); A61B 5/1495 (2006.01)
CPC G01N 27/3274 (2013.01) [A61B 5/1495 (2013.01); A61B 5/14532 (2013.01); A61B 2560/0223 (2013.01)] 36 Claims
OG exemplary drawing
1. A preconnected sensor assembly comprising:
a sensor having at least one electrical contact, the sensor configured to sense an analyte concentration;
a housing;
sensor electronics;
an interposer having:
a substrate to mechanically interface the sensor with the sensor electronics, and
a contact electrically coupled with the at least one electrical contact of the sensor, the contact disposed on an external surface of the interposer, the contact configured to electrically interface the sensor with the sensor electronics; and
a package, the sensor and the sensor electronics being positioned within the package, the sensor preconnected to the sensor electronics via the interposer,
wherein the substrate of the interposer is configured to mechanically interface with the housing and with one or more manufacturing equipment for allowing measurement of at least one sensor property via the interposer.