US 11,656,108 B2
Sensor and associated methods
Steve A. Robison, Vandalia, MI (US); Anand Hariharan, Guyton, GA (US); Kayon W. Chin, East Peoria, IL (US); and Richard J. Evans, Morton, IL (US)
Assigned to Parker-Hannifin Corporation, Cleveland, OH (US)
Filed by Parker-Hannifin Corporation, Cleveland, OH (US)
Filed on Jun. 2, 2022, as Appl. No. 17/830,467.
Claims priority of provisional application 63/287,154, filed on Dec. 8, 2021.
Claims priority of provisional application 63/237,879, filed on Aug. 27, 2021.
Prior Publication US 2023/0061380 A1, Mar. 2, 2023
Int. Cl. G01D 11/24 (2006.01); G01D 5/12 (2006.01); H05K 3/30 (2006.01); H05K 5/06 (2006.01)
CPC G01D 11/245 (2013.01) [G01D 5/12 (2013.01); H05K 3/303 (2013.01); H05K 5/06 (2013.01); H05K 2203/1305 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A sensor comprising:
a housing having an internal chamber;
a printed circuit board (PCB) mounted in the internal chamber of the housing, wherein the PCB comprises one or more calibration electrical contact points;
a sealing grommet mounted in the internal chamber, wherein the sealing grommet comprises an axial hole aligned with the calibration electrical contact points, thereby providing access to the calibration electrical contact points of the PCB;
a grommet plug disposed in the axial hole of the sealing grommet;
a sensing element disposed in the housing and electrically-coupled to the PCB via an electrical connection;
an encapsulant sealing material deposited on the sealing grommet and the grommet plug, wherein the grommet plug is configured to seal the axial hole to preclude the encapsulant sealing material from flowing through the axial hole, and to preclude access to the calibration electrical contact points once the encapsulant sealing material is deposited; and
an external cable connected to the PCB and extending through the sealing grommet and through the encapsulant sealing material.