US 11,656,006 B2
Thermoelectric cooler systems for thermal enhancement in immersion cooling and associated methods thereof
Paul Artman, Research Triangle Park, NC (US); Jeffrey Holland, Research Triangle Park, NC (US); and Vinod Kamath, Research Triangle Park, NC (US)
Assigned to Lenovo Enterprise Solutions (Singapore) Pte. Ltd., New Tech Park (SG)
Filed by Lenovo Enterprise Solutions (Singapore) Pte. Ltd., New Tech Park (SG)
Filed on Mar. 31, 2020, as Appl. No. 16/836,727.
Prior Publication US 2021/0302074 A1, Sep. 30, 2021
Int. Cl. F25B 21/02 (2006.01); H05K 7/20 (2006.01)
CPC F25B 21/02 (2013.01) [H05K 7/20236 (2013.01); H05K 7/20272 (2013.01); H05K 7/20281 (2013.01); F25B 2321/023 (2013.01); F25B 2321/0251 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A system comprising:
a liquid vessel having an interior surface that defines an interior space, the liquid vessel being configured to hold a cooling liquid and an electronic component, wherein the electronic component is positioned within the cooling liquid of the interior space;
a heat conduit in heat conductive contact with the electronic component and configured to conductively transfer heat from the electronic component; and
a thermoelectric cooler positioned within the cooling liquid of the interior space,
the thermoelectric cooler including an absorption side in heat conductive contact with the heat conduit and a rejection side in conductive contact with the interior surface, the thermoelectric cooler being configured to transfer heat from the heat conduit to the interior surface of the liquid vessel,
such that the heat conduit is configured to transfer heat from the electronic component to the cooling liquid and configured to transfer heat from the electronic component to the absorption side of the thermoelectric cooler.