US 11,655,555 B2
Advanced reverse treated electrodeposited copper foil and copper clad laminate using the same
Yun-Hsing Sung, Taoyuan (TW); Shih-Shen Lee, New Taipei (TW); Hung-Wei Hsu, Yun Lin (TW); and Chun-Yu Kao, Yunlin County (TW)
Assigned to CO-TECH DEVELOPMENT CORP., Yun Lin (TW)
Filed by CO-TECH DEVELOPMENT CORP., Yun Lin (TW)
Filed on Jun. 12, 2020, as Appl. No. 16/899,585.
Claims priority of provisional application 62/860,766, filed on Jun. 12, 2019.
Prior Publication US 2020/0392640 A1, Dec. 17, 2020
Int. Cl. C23D 15/00 (2006.01); C25D 15/00 (2006.01); C25D 3/38 (2006.01); H05K 1/02 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01); B32B 15/01 (2006.01); H05K 1/09 (2006.01)
CPC C25D 15/00 (2013.01) [B32B 15/01 (2013.01); B32B 15/04 (2013.01); B32B 15/20 (2013.01); C25D 3/38 (2013.01); H05K 1/0237 (2013.01); H05K 1/09 (2013.01); B32B 2311/12 (2013.01); H05K 2201/0355 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An advanced reverse treated electrodeposited copper foil characterized in that said copper foil has an uneven micro-roughened surface that has a plurality of non-uniformly distributed copper crystals, wherein a number of the copper crystals are stacked together to form one of a plurality of copper whiskers, and a number of the copper whiskers are grouped together to form one of a plurality of copper crystal groups, and wherein the copper crystals, the copper whiskers and the copper crystal groups form into a non-uniformly distributed stripe pattern as observed from a scanning electron microscope image of the micro-roughened surface taken with a +35 degree tilt and under 1,000× magnification.