US 11,655,523 B2
Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar
Hirotaka Matsunaga, Kitamoto (JP); Kenichiro Kawasaki, Kitamoto (JP); Hiroyuki Mori, Tsukuba (JP); Kazunari Maki, Saitama (JP); and Yoshiteru Akisaka, Aizuwakamatsu (JP)
Assigned to MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
Appl. No. 17/40,928
Filed by MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
PCT Filed Mar. 28, 2019, PCT No. PCT/JP2019/013496
§ 371(c)(1), (2) Date Sep. 23, 2020,
PCT Pub. No. WO2019/189534, PCT Pub. Date Oct. 3, 2019.
Claims priority of application No. JP2018-069095 (JP), filed on Mar. 30, 2018.
Prior Publication US 2021/0363612 A1, Nov. 25, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. B32B 15/01 (2006.01); C22C 9/00 (2006.01); C22F 1/08 (2006.01); H01B 1/02 (2006.01); H01B 5/02 (2006.01)
CPC C22C 9/00 (2013.01) [B32B 15/01 (2013.01); C22F 1/08 (2013.01); H01B 1/026 (2013.01); H01B 5/02 (2013.01); B32B 2457/00 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A copper alloy plate or strip material for electronic or electric devices, comprising:
a copper alloy, wherein
a thickness of the copper alloy plate or strip material is more than 3.0 mm,
the copper alloy plate or strip material is a rolled material,
the copper alloy contains:
Mg at an amount in a range of 0.15 mass % or greater and less than 0.35 mass %; and
P at an amount in a range of 0.0005 mass % or greater and less than 0.01 mass %, with a remainder being Cu and unavoidable impurities,
an amount of Mg [Mg] and an amount of P [P] of the copper alloy in terms of mass ratio satisfy a relation:
[Mg]+20×[P]≤0.5, and
a surface orthogonal to a rolling width direction is used as an observation surface, measurement regarding a matrix is performed on a measurement area of 10,000 μm2 or larger at every measurement intervals of 0.25 μm by an EBSD method, measured results are analyzed by Orientation Imaging Microscopy (OIM) data analysis software to obtain a CI value in each measurement point, a measurement point in which a CI value is 0.1 or less is removed, a boundary having more than 15° of an orientation difference between neighboring measuring points is assigned as a grain boundary, a coincidence boundary in which a Σ value is 29 or less is defined as a special grain boundary, and the remaining grain boundaries are defined as random grain boundaries,
then, with regard to grain boundary triple junctions analyzed by the OIM data analysis software, 0.20<(NFJ2/(1−NFJ3))0.5 <0.45 is satisfied in a case where a proportion of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to total grain boundary triple junctions is represented by NFJ3, and a proportion of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary is a random grain boundary, to the total grain boundary triple junctions is represented by NFJ2, and
when the copper alloy plate or strip material is punched under a condition where a die clearance is 3% with respect to the thickness of the copper alloy plate or strip material, a height of a burr generated at the time of punching is 3.0% or less with respect to the thickness of the copper alloy plate or strip material.