US 11,655,363 B2
Tableted epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the same
Sang Jin Kim, Suwon-si (KR); Sang Kyun Kim, Suwon-si (KR); Tae Shin Eom, Suwon-si (KR); Dong Hwan Lee, Suwon-si (KR); Young Joon Lee, Suwon-si (KR); and Yong Han Cho, Suwon-si (KR)
Assigned to SAMSUNG SDI CO., LTD., Yongin-si (KR)
Filed by SAMSUNG SDI CO., LTD., Yongin-si (KR)
Filed on Dec. 18, 2019, as Appl. No. 16/719,046.
Claims priority of application No. 10-2018-0166693 (KR), filed on Dec. 20, 2018.
Prior Publication US 2020/0199351 A1, Jun. 25, 2020
Int. Cl. C08L 83/00 (2006.01); C08L 63/00 (2006.01); B29B 9/08 (2006.01); B29B 9/12 (2006.01); H01L 23/29 (2006.01); H01L 21/56 (2006.01); C08J 3/22 (2006.01); H01L 25/065 (2023.01); B29K 63/00 (2006.01); B29K 509/02 (2006.01); B29C 43/00 (2006.01); B29K 105/00 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01)
CPC C08L 63/00 (2013.01) [B29B 9/08 (2013.01); B29B 9/12 (2013.01); C08J 3/226 (2013.01); H01L 21/565 (2013.01); H01L 23/295 (2013.01); B29C 43/003 (2013.01); B29K 2063/00 (2013.01); B29K 2105/251 (2013.01); B29K 2509/02 (2013.01); B29K 2995/0013 (2013.01); C08L 2203/206 (2013.01); C08L 2205/025 (2013.01); C08L 2310/00 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01)] 20 Claims
 
1. A tableted epoxy resin composition for encapsulation of semiconductor devices, the tableted epoxy resin composition satisfying the following conditions:
(i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves;
(ii) the tablets have a packed density of greater than 1.7 g/mL; and
(iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.