US 11,654,498 B2
Nickel-based brazing foil and process for brazing
Thomas Hartmann, Altenstadt (DE); and Dieter Nuetzel, Hainburg (DE)
Assigned to VACUUMSCHMELZE GMBH & CO. KG, Hanau (DE)
Filed by VACUUMSCHMELZE GMBH & CO. KG, Hanau (DE)
Filed on Jun. 5, 2020, as Appl. No. 16/893,669.
Application 16/893,669 is a division of application No. 16/175,598, filed on Oct. 30, 2018, granted, now 11,130,187.
Application 16/175,598 is a division of application No. 15/082,338, filed on Mar. 28, 2016, granted, now 10,137,517, issued on Nov. 27, 2018.
Application 15/082,338 is a continuation of application No. 12/285,754, filed on Oct. 14, 2008, granted, now 9,757,810, issued on Sep. 12, 2017.
Claims priority of provisional application 60/960,796, filed on Oct. 15, 2007.
Claims priority of application No. 10 2007 049 508.2 (DE), filed on Oct. 15, 2007.
Prior Publication US 2020/0298329 A1, Sep. 24, 2020
This patent is subject to a terminal disclaimer.
Int. Cl. B23K 35/30 (2006.01); B23K 1/00 (2006.01); B23K 35/02 (2006.01); C22C 19/05 (2006.01); C22C 45/04 (2006.01); C22F 3/00 (2006.01); F28F 21/08 (2006.01); F02M 26/29 (2016.01); C22C 1/11 (2023.01); B23K 1/19 (2006.01); C22F 1/00 (2006.01); C22F 1/10 (2006.01)
CPC B23K 1/0012 (2013.01) [B23K 1/19 (2013.01); B23K 35/0233 (2013.01); B23K 35/304 (2013.01); B23K 35/3033 (2013.01); C22C 1/11 (2023.01); C22C 19/05 (2013.01); C22C 19/058 (2013.01); C22C 45/04 (2013.01); C22F 1/002 (2013.01); C22F 1/10 (2013.01); C22F 3/00 (2013.01); F02M 26/29 (2016.02); F28F 21/083 (2013.01); F28F 21/089 (2013.01); Y10T 428/12944 (2015.01); Y10T 428/12972 (2015.01)] 13 Claims
OG exemplary drawing
 
1. A process for joining two or more parts comprising:
inserting a brazing foil between two or more parts to be joined, wherein the parts to be joined have a higher melting temperature than that the brazing foil to form a solder joint and the brazing foil comprises an amorphous, ductile Ni-based brazing foil having a composition consisting essentially of
NirestCraBbPcSidCeXfYg
wherein a, b, c, d, e, f, and g are numbers such that 16 atomic percent≤a≤30 atomic percent; 0.5 atomic percent≤b≤14 atomic percent; 2 atomic percent≤c≤20 atomic percent; 0 atomic percent≤d≤14 atomic percent; 0 atomic percent≤e≤5 atomic percent; 0 atomic percent<f≤3 atomic percent; 0 atomic percent≤g≤5 atomic percent; and 0 atomic percent≤0.5 atomic percent incidental impurities; wherein rest is the balance of the composition; wherein c>b>c/15; wherein 10 atomic percent≤b+c+d≤25 atomic percent, wherein X is one or more of the elements Mo, Nb, Ta, W and Cu; and wherein Y is one or both of the elements Fe and Co;
heating the solder joint to a temperature above the liquidus temperature of the brazing foil to form a heated solder joint; and
cooling the heated solder joint, thereby forming a brazed joint between the parts to be joined.