US 11,654,265 B2
Connection structure and guide wire having the connection structure
Satoshi Yonezawa, Iwate-gun (JP)
Assigned to ASAHI INTECC CO., LTD., Nagoya (JP)
Filed by ASAHI INTECC CO., LTD., Seto (JP)
Filed on Feb. 13, 2020, as Appl. No. 16/789,832.
Application 16/789,832 is a continuation of application No. 15/425,149, filed on Feb. 6, 2017, granted, now 10,576,253.
Application 15/425,149 is a continuation of application No. PCT/JP2016/077176, filed on Sep. 14, 2016.
Prior Publication US 2020/0179658 A1, Jun. 11, 2020
This patent is subject to a terminal disclaimer.
Int. Cl. A61M 25/09 (2006.01)
CPC A61M 25/09 (2013.01) [A61M 2025/09083 (2013.01); A61M 2025/09108 (2013.01); A61M 2025/09133 (2013.01); A61M 2025/09141 (2013.01); A61M 2025/09175 (2013.01); A61M 2025/09191 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A connection structure comprising:
a first metal body comprising a first metal;
a second metal body comprising a second metal; and
a multi-thread coil wrapped around a portion of an outermost circumferential surface of a cylindrical distal end of the first metal body and an outermost circumferential surface of a cylindrical proximal end of the second metal body, the multi-thread coil comprising:
a first element wire comprising the first metal; and
a second element wire comprising the second metal,
wherein:
the first element wire is connected to the outermost circumferential surface of the distal end of first metal body, and
the second element wire is connected to the outermost circumferential surface of the proximal end of the second metal body.