| CPC H10K 59/131 (2023.02) | 20 Claims |

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1. A light-emission driving substrate for driving light-emitting elements, the light-emission driving substrate comprises a light-emitting area and a non-light-emitting area that is disposed around at least a part of the light-emitting area, and the non-light-emitting area comprises a binding area for binding a driving chip, wherein the light-emission driving substrate comprises:
a substrate; and
a device layer disposed on the substrate, wherein the device layer comprises a plurality of first signal lines and second signal lines that are disposed in the light-emitting area, and comprises a plurality of first connection terminals and second connection terminals that are disposed in the non-light-emitting area, each of the plurality of first connection terminals is electrically connected to an anode of the light-emitting element through the one of the plurality of first signal lines, and each of the second connection terminals is electrically connected to a cathode of the light-emitting element through one of the second signal lines;
wherein a distance between at least one of the plurality of first connection terminals and the binding area is smaller than a distance between each of the second connection terminals and the binding area.
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