| CPC H10H 20/01335 (2025.01) [H10H 20/856 (2025.01); H10H 20/857 (2025.01); H10H 20/0361 (2025.01); H10H 20/0363 (2025.01); H10H 20/0364 (2025.01)] | 11 Claims |

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1. A method for manufacturing an image display device, the method comprising:
providing a second substrate that comprises a first substrate, and a semiconductor layer grown on the first substrate, the semiconductor layer comprising a light-emitting layer;
providing a third substrate comprising:
a light-transmitting substrate,
a circuit element formed on the light-transmitting substrate,
a wiring layer connectable to the circuit element, and
a first insulating film covering the circuit element and the wiring layer;
bonding the semiconductor layer to the third substrate;
forming a light-emitting element from the semiconductor layer;
forming a second insulating film covering the light-emitting element;
forming a via extending through the first and second insulating films; and
electrically connecting the light-emitting element and the circuit element by the via; wherein:
the wiring layer comprises a light-reflective part;
the light-emitting element is located on the light-reflective part such that a portion of the first insulating film is located between the light emitting element and the light-reflective part; and
in a plan view, an outer perimeter of the light-emitting element, when projected onto the light-reflective part, is located within an outer perimeter of the light-reflective part.
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