US 12,310,104 B2
Full-reflection display substrate, manufacturing method thereof and full-reflection display device
Jiguo Wang, Beijing (CN); Jian Sun, Beijing (CN); and Jiantao Liu, Beijing (CN)
Assigned to Technology Group Co., Ltd., Beijing (CN)
Appl. No. 17/624,878
Filed by BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Apr. 15, 2021, PCT No. PCT/CN2021/087469
§ 371(c)(1), (2) Date Jan. 5, 2022,
PCT Pub. No. WO2021/227765, PCT Pub. Date Nov. 18, 2021.
Claims priority of application No. 202010402256.0 (CN), filed on May 13, 2020.
Prior Publication US 2022/0285406 A1, Sep. 8, 2022
Int. Cl. H10K 59/80 (2023.01); H10D 86/01 (2025.01); H10D 86/40 (2025.01); H10K 59/123 (2023.01); A23B 2/20 (2025.01); A23B 11/86 (2025.01); C01G 45/022 (2025.01); H10D 10/80 (2025.01)
CPC H10D 86/0231 (2025.01) [H10D 86/451 (2025.01); A23B 2/20 (2025.01); A23B 11/86 (2025.01); C01G 45/022 (2025.01); H10D 10/821 (2025.01)] 11 Claims
OG exemplary drawing
 
1. A full-reflection display substrate, comprising:
a base substrate, the base substrate including a display region and a non-display region;
a signal line arranged in the display region;
a bonding pin arranged in the non-display region, coupled to the signal line and bonded to a driving circuitry;
a reflection layer arranged in the display region; and
an etch stop pattern arranged at a same layer and made of a same material as the reflection layer, arranged in the non-display region, and at least covering a side surface of the bonding pin;
wherein the reflection layer is reused as a pixel electrode.