| CPC H10D 84/85 (2025.01) [H10B 61/22 (2023.02); H10B 63/30 (2023.02); H10N 50/01 (2023.02); H10N 50/10 (2023.02); H10N 50/80 (2023.02); H10N 70/011 (2023.02); H10N 70/253 (2023.02); H10N 70/841 (2023.02); H10N 70/8833 (2023.02)] | 13 Claims |

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1. A complementary metal oxide semiconductor (CMOS) structure, comprising:
a first transistor comprising:
a first gate dielectric layer above a first channel, the first gate dielectric layer comprising Hf1-xZrxO2, wherein the first gate dielectric layer has a thickness of at least 1.3 nm;
a first gate electrode coupled to the first channel through the first gate dielectric layer;
a gate dielectric layer comprising oxygen and one or more of aluminum, lanthanum or yttrium located between the first gate dielectric layer and the channel and having a thickness between 0.7 nm and 1 nm;
and
a first source region and a first drain region of a first conductivity type on opposite sides of the first gate electrode; and
a second transistor comprising:
a second gate dielectric layer above a second channel, the second gate dielectric layer comprising Hf1-xZrxO2, wherein x for the second gate dielectric layer is greater than x for the first gate dielectric layer;
a second gate electrode coupled to the second channel through the second gate dielectric layer; and
a second source region and a second drain region of a second, complementary, conductivity type on opposite sides of the second gate electrode.
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