| CPC H10B 12/33 (2023.02) [H01L 21/31111 (2013.01); H01L 21/32133 (2013.01); H01L 21/764 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 23/528 (2013.01); H10B 12/05 (2023.02); H10B 12/482 (2023.02); H10B 12/488 (2023.02); H10D 30/031 (2025.01); H10D 30/6728 (2025.01); H10D 30/6735 (2025.01); H10D 30/6755 (2025.01); H10D 62/292 (2025.01); H10D 99/00 (2025.01)] | 18 Claims |

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1. A semiconductor device, comprising:
a first vertical transistor, comprising:
a first channel region;
a first word line wrapping the first channel region; and
a first word line dielectric layer between the first channel region and the first word line;
a second vertical transistor adjacent to the first vertical transistor, comprising:
a second channel region;
a second word line wrapping the second channel region; and
a second word line dielectric layer between the second channel region and the second word line;
a dielectric layer wrapping upper portions of the first word line and the second word line; and
an air gap inserted between lower portions of the first vertical transistor and the second vertical transistor.
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