US 12,309,982 B2
Power conversion device
Shingo Kitagawa, Tokyo (JP); Daisuke Sasaki, Tokyo (JP); Kohei Ando, Tokyo (JP); Yoshifumi Mizuno, Tokyo (JP); Yoshitsugu Hirayama, Tokyo (JP); Hirofumi Inoue, Tokyo (JP); and Koji Uyama, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Oct. 17, 2022, as Appl. No. 17/967,586.
Claims priority of application No. 2021-185468 (JP), filed on Nov. 15, 2021.
Prior Publication US 2023/0156980 A1, May 18, 2023
Int. Cl. H05K 7/20 (2006.01); H02M 7/00 (2006.01)
CPC H05K 7/20927 (2013.01) [H02M 7/003 (2013.01); H05K 7/20254 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A power conversion device, comprising:
a semiconductor module;
a smoothing capacitor configured to smooth an input voltage to the semiconductor module;
a bus bar assembly configured to electrically connect at least two of the semiconductor module, the smoothing capacitor, and a power supply; and
a cooler; and
a cooling plate, which is connected to a cooling plate connection member being at least one of the smoothing capacitor and the bus bar assembly, and is connected to the cooler,
wherein the semiconductor module, the bus bar assembly, and the smoothing capacitor are superposed on the cooler in the stated order from the cooler side,
wherein at least one of a cooling column-equipped member, which is at least one of the smoothing capacitor and the bus bar assembly, and the cooler is provided with a cooling column configured to transfer heat of the cooling column-equipped member to the cooler, and
wherein at least a part of the cooling plate is embedded in the cooling plate connection member.