US 12,309,981 B2
Power electronics module
Manuel Raimann, Salem (DE); and Pengshuai Wang, Eriskirch (DE)
Assigned to ZF Friedrichshafen AG, Friedrichshafen (DE)
Filed by ZF Friedrichshafen AG, Friedrichshafen (DE)
Filed on Jul. 19, 2023, as Appl. No. 18/355,182.
Claims priority of application No. 102022207435.1 (DE), filed on Jul. 21, 2022.
Prior Publication US 2024/0032260 A1, Jan. 25, 2024
Int. Cl. H05K 7/20 (2006.01); B60L 50/70 (2019.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H02M 3/28 (2006.01)
CPC H05K 7/209 (2013.01) [B60L 50/70 (2019.02); H01L 23/367 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 23/49861 (2013.01); H02M 3/28 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A power electronics module, comprising:
a printed circuit board populated with a plurality of components of the power electronics module, at least some of which form discrete power semiconductors each comprising a housing, wherein a first side of the housing is configured to thermally connect to an upper surface of a heat sink, and wherein another side of the housing are configured to be attached to the printed circuit board and brought into electrical contact;
the heat sink opposite the first side of the housings of the power semiconductors, the upper surface of which is thermally connected to a first side of each power semiconductor;
electrically conductive DC and AC connecting elements configured to obtain electric contact to the power semiconductors; and
an insulator located between the printed circuit board and the heat sink, wherein the insulator comprises an insulated metal substrate between the power semiconductors and the heat sink, wherein the insulated metal substrate comprises a metal core, an insulating layer, and a metal layer, wherein the insulated metal substrate is placed such that the metal layer is connected to the heat sink, and the metal core is connected to the power semiconductors, and is structured such that it functions as the DC and AC connecting elements.