US 12,309,974 B2
Thermal management in an electronic device chassis
Gerard MacManus, Surrey (GB)
Assigned to Rakuten Symphony, Inc., Tokyo (JP)
Appl. No. 18/021,605
Filed by Rakuten Symphony, Inc., Tokyo (JP)
PCT Filed Jul. 29, 2022, PCT No. PCT/US2022/038825
§ 371(c)(1), (2) Date Feb. 16, 2023,
PCT Pub. No. WO2023/229621, PCT Pub. Date Nov. 30, 2023.
Claims priority of provisional application 63/345,777, filed on May 25, 2022.
Prior Publication US 2024/0268073 A1, Aug. 8, 2024
Int. Cl. H01L 23/36 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 7/20 (2006.01)
CPC H05K 7/2039 (2013.01) [H05K 1/0201 (2013.01); H05K 1/14 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A chassis for electronic device circuitry, the chassis comprising:
a mounting surface on a first side of the chassis;
a cooling surface on a second side of the chassis opposite the mounting surface, the cooling surface having a plurality of heatsink fins;
at least one vapor chamber between the mounting surface and the cooling surface, the at least one vapor chamber located adjacent the plurality of heatsink fins,
the chassis further comprising at least one thermal break, and wherein the plurality of heatsink fins is organized into at least two fin sections, wherein a first fin section of the at least two fin sections comprises a first set of fins of the plurality of fins and a second fin section of the at least two fin sections comprises a second set of fins of the plurality of fins, and wherein the at least one thermal break is an air gap defining a channel between the first fin section and the second fin section,
wherein a first vapor chamber of the at least one vapor chamber is adjacent the first fin section, a second vapor chamber of the at least one vapor chamber is adjacent the second fin section, and no vapor chamber is adjacent the thermal break,
wherein the electronic device circuitry comprises a plurality of printed circuit boards (PCBs) and wherein each of the first vapor chamber and the second vapor chamber are located between a corresponding PCB mounting location on the mounting surface and the corresponding fin section on the cooling surface,
wherein at least one of the PCBs includes an electronic device surface mounted on the PCB such that the PCB intercedes between the electronic device and the mounting surface, and wherein the PCB further comprises thermal vias defining a thermal path between the electronic device and the mounting surface,
wherein the electronic device surface mounted is an integrated circuit die mounted on a die-attach paddle, and wherein the thermal vias are adjacent the die-attach paddle.