US 12,309,973 B2
Heat dissipating plate, manufacturing method therefor and electronic device having the same
Chien-Yu Chen, New Taipei (TW)
Assigned to THERLECT CO., LTD., New Taipei (TW)
Filed by THERLECT CO., LTD., New Taipei (TW)
Filed on Feb. 22, 2023, as Appl. No. 18/112,739.
Application 18/112,739 is a division of application No. 16/667,427, filed on Oct. 29, 2019, granted, now 11,617,283.
Claims priority of application No. 108124221 (TW), filed on Jul. 10, 2019.
Prior Publication US 2023/0200015 A1, Jun. 22, 2023
Int. Cl. H05K 7/20 (2006.01); F28D 15/04 (2006.01)
CPC H05K 7/20336 (2013.01) [F28D 15/04 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method for manufacturing a heat dissipating plate, comprising:
providing a first substrate and a second substrate, wherein the first substrate has a through hole, and the second substrate has a first region and a second region defined thereon;
disposing a capillary structure layer on the first region;
disposing a plurality of support structures on the second region;
disposing a sealing glue layer on the second substrate, wherein the sealing glue layer surrounds the first region and the second region;
attaching the first substrate to the second substrate through the sealing glue layer so that the first substrate is positioned over the second substrate to form a cavity between the first substrate and the second substrate, the capillary structure layer defines a first flow space in the first region, and the plurality of support structures define a plurality of flow channels constituting a second flow space in the second region;
injecting a heat dissipating liquid into the cavity through the through hole, wherein a liquid amount of the heat dissipating liquid injected into the cavity is more than 50% of a total capacity of the first flow space and the second flow space;
heating the first substrate or the second substrate for a predetermined time duration to drive a first part of air out of the cavity through the through hole and to keep a second part of the air in the cavity; and
sealing the through hole to convert the cavity into a non-vacuum sealed cavity with the first part of the air driven out of the cavity through the through hole and with the second part of the air kept in the cavity.