US 12,309,971 B2
Dual-stacked motherboards for fluid immersion cooling
Yueh Ming Liu, Taipei (TW); Yu Hsiang Huang, Taipei (TW); Yu Chuan Chang, Taipei (TW); Hsiao Chung Chen, Taipei (TW); and Tan Hsin Chang, Taipei (TW)
Assigned to Super Micro Computer, Inc., San Jose, CA (US)
Filed by SUPER MICRO COMPUTER, INC., San Jose, CA (US)
Filed on Jan. 20, 2022, as Appl. No. 17/579,958.
Prior Publication US 2023/0232582 A1, Jul. 20, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/203 (2013.01) [H05K 7/20809 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A computer system comprising:
a first node assembly comprising a first motherboard and a second motherboard, the first motherboard having a first processor and a first plurality of memory cards mounted thereon, the second motherboard having a second processor and a second plurality of memory cards mounted thereon, each of the first plurality of memory cards and the second plurality of memory cards having an integrated circuit (IC) memory chip,
wherein a first plate having a boiling enhancement coating (BEC) is attached to a surface of the first processor, a second plate having a BEC coating is attached to a surface of the second processor, the first plate attached to the surface of the first processor and the second plate attached to the surface of the second processor face toward and overlap each other, and
each memory card of the first plurality of memory cards is interlaced between corresponding adjacent memory cards of the second plurality of memory cards; and
a fluid immersion cooling tank, wherein the first processor, the second processor, the first plurality of memory cards, and the second plurality of memory cards are immersed in a dual-phase coolant fluid in the fluid immersion cooling tank, the dual-phase coolant fluid configured to pass between the first plate and the second plate.