US 12,309,969 B2
Receptacle with connectable spring finger for multipoint contact conduction cooling
Harvey J. Lunsman, Chippewa Falls, WI (US); Ernesto Ferrer, Aguadilla, OR (US); and John Franz, Houston, TX (US)
Assigned to Hewlett Packard Enterprise Development LP, Spring, TX (US)
Filed by HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP, Spring, TX (US)
Filed on Jun. 30, 2023, as Appl. No. 18/345,213.
Application 18/345,213 is a division of application No. 17/155,304, filed on Jan. 22, 2021, granted, now 11,729,943.
Prior Publication US 2023/0345668 A1, Oct. 26, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20254 (2013.01) [H05K 7/20336 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic system comprising:
a host device comprising a cooling component;
a removable device comprising a heat spreader, wherein the removable device is detachably connectable to the host device;
a receptacle comprising a plurality of spring fingers, coupled to the heat spreader; and
a heat transfer device comprising a first portion and a second portion, wherein the first portion is coupled to the cooling component, and the second portion is protruded outwards relative to the cooling component, wherein, when the removable device is connected to the host device, the second portion extends through the receptacle such that the plurality of spring fingers establish a direct thermal interface with the second portion and thermally couple the cooling component to the heat spreader to allow a waste-heat to transfer between the heat spreader and the cooling component via the heat transfer device and the receptacle.