US 12,309,968 B2
Cold plate module
Yu Ting Tseng, Chiayi County (TW); and Jih-Che Yeh, New Taipei (TW)
Assigned to ACCTON TECHNOLOGY CORPORATION, Hsinchu (TW)
Filed by ACCTON TECHNOLOGY CORPORATION, Hsinchu (TW)
Filed on Mar. 22, 2023, as Appl. No. 18/188,447.
Claims priority of application No. 111203673 (TW), filed on Apr. 12, 2022.
Prior Publication US 2023/0328922 A1, Oct. 12, 2023
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20254 (2013.01) [G06F 1/20 (2013.01); H05K 7/20327 (2013.01); F28F 2265/16 (2013.01); G06F 2200/201 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A cold plate module, comprising:
a cold plate, comprising:
a main body having a first surface and a second surface opposite to the first surface, the first surface being configured to abut against a heat source disposed on a motherboard;
an inlet port connected with the second surface and communicated with the main body, the inlet port having an entrance configured to allow a cooling liquid to flow into the main body; and
an outlet port connected with the second surface and communicated with the main body, the outlet port having an exit configured to allow the cooling liquid to flow away from the main body;
a structural piece having a third surface and a fourth surface opposite to the third surface, the third surface being configured to connect with the second surface, the structural piece being configured to connect with the motherboard;
a frame connected with the fourth surface and defining an accommodation space together with the fourth surface, the inlet port and the outlet port being at least partially located within the accommodation space; and
an absorbing element connected with the fourth surface and disposed within the accommodation space, the inlet port and the outlet port at least partially penetrating through the structural piece and the absorbing element, the absorbing element being at least partially located between the fourth surface and both of the entrance and the exit.