US 12,309,966 B2
Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force
Jin Yang, Hillsboro, OR (US); Jimmy Chuang, Taipei (TW); Mengqi Liu, Hillsboro, OR (US); Phil Geng, Washougal, WA (US); Ralph V. Miele, Hillsboro, OR (US); Sandeep Ahuja, Portland, OR (US); and David Shia, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 14, 2021, as Appl. No. 17/475,026.
Claims priority of provisional application 63/217,058, filed on Jun. 30, 2021.
Prior Publication US 2021/0410329 A1, Dec. 30, 2021
Int. Cl. H05K 7/20 (2006.01); H01L 23/367 (2006.01)
CPC H05K 7/20254 (2013.01) [H01L 23/3677 (2013.01); H05K 7/20272 (2013.01); H05K 7/20281 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a ceiling part and a floor part of a thermally conductive component to be placed upon an integrated heat spreader to remove heat from at least one semiconductor chip within a semiconductor chip package associated with the integrated heat spreader, the floor part and the ceiling part to be pressed against one another to form the thermally conductive component, one or more cavities exist within the thermally conductive component between respective inner surfaces of the floor part and the ceiling part that face one another when the floor part and the ceiling part are pressed against one another; and
a frame component to be abutted against at least one of the ceiling part or the floor part to impede deformation of at least one of the ceiling part or the floor part when loading forces are being applied to a thermal assembly that includes the thermally conductive component and the semiconductor chip package, the frame component to reside between the floor part and the integrated heat spreader.