US 12,309,963 B2
Electronic device assembly, expansion component thereof, and heat dissipation module
Jui-Lin Yang, Taipei (TW); Wan-Lin Hsu, Taipei (TW); Hsin-Chih Chou, Taipei (TW); Kun-Cheng Lee, Taipei (TW); and Juei-Chi Chang, Taipei (TW)
Assigned to Getac Technology Corporation, New Taipei (TW)
Filed by Getac Technology Corporation, New Taipei (TW)
Filed on Feb. 6, 2023, as Appl. No. 18/164,922.
Claims priority of provisional application 63/309,463, filed on Feb. 11, 2022.
Claims priority of provisional application 63/351,422, filed on Jun. 12, 2022.
Claims priority of application No. 202211467557.7 (CN), filed on Nov. 22, 2022.
Prior Publication US 2023/0276596 A1, Aug. 31, 2023
Int. Cl. H05K 7/20 (2006.01); G06F 1/16 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20154 (2013.01) [G06F 1/1632 (2013.01); G06F 1/203 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An expansion component, comprising:
a case, comprising a bottom plate, a top plate, and an accommodating space located between the bottom plate and the top plate;
a partition, arranged in the accommodating space and parallel to the bottom plate, wherein the partition divides the accommodating space into an upper compartment and a lower compartment;
a plurality of electronic components, scattered in the upper compartment and the lower compartment, wherein one of the electronic components located in the upper compartment abuts against the partition; and
a heat dissipation module, arranged in the case and comprising:
a flow guide case, comprising an input section and an output section that are connected, wherein an angle is defined between an extending direction of the input section and an extending direction of the output section, the flow guide case is accommodated in the lower compartment, and the output section abuts against the partition and one of the electronic components located in the lower compartment; and
a fan, arranged at a junction of the input section and the output section.